System and method for control of high efficiency generator source impedance

ABSTRACT

Systems and methods for adjusting the source impedance of a generator are disclosed. An exemplary method includes generating a first signal and applying the first signal to a first input of a combiner, generating a second signal and applying the second signal to a second input of said combiner, and combining the first and second signals with the combiner at an output of the combiner to produce power that is delivered to the plasma load. A controllable variable impedance is provided to an isolation port of the combiner, and the controllable variable impedance is adjusted to vary the source impedance of the generator.

CLAIM OF PRIORITY UNDER 35 U.S.C. §120

The present Application for Patent is a Continuation of patentapplication Ser. No. 14/667,079 entitled “SYSTEM AND METHOD FOR CONTROLOF HIGH EFFICIENCY GENERATOR SOURCE IMPEDANCE” filed Mar. 24, 2015,pending, and assigned to the assignee hereof and hereby expresslyincorporated by reference herein.

BACKGROUND Field

The present invention relates generally to plasma processing systems,and more specifically to interactions between power sources and plasmas.

Background

Plasma processing systems are widely used in a variety of industries formodifying the surface properties of materials. For example, themanufacture of modern integrated circuits generally involves manyprocessing steps that use plasmas for etching of submicrometer features,or for depositing atomically thin layers of materials.

A typical plasma processing system comprises a processing chamber and apower delivery system that creates and maintains the plasma inside thechamber. Electrically, the plasma is a load with a characteristicimpedance that is driven by the power generator. The impedance of aprocessing plasma is generally not constant, however, but may varydepending upon process conditions or other variables. Variations inplasma impedance may adversely affect the power delivery from thegenerator, which typically provides optimal power delivery only for aparticular load impedance. These variations may also result in undesireddrifts or perturbations in process variables, such as etch or depositionrates, due to changes in the physical properties of the plasma atdifferent power levels. As a result, plasma processing systems are oftenequipped with impedance matching and control mechanisms or circuitrythat respond to changes in plasma impedance and maintain desired levelsof power delivery to the plasma.

SUMMARY

The following presents a simplified summary relating to one or moreaspects and/or embodiments disclosed herein. As such, the followingsummary should not be considered an extensive overview relating to allcontemplated aspects and/or embodiments, nor should the followingsummary be regarded to identify key or critical elements relating to allcontemplated aspects and/or embodiments or to delineate the scopeassociated with any particular aspect and/or embodiment. Accordingly,the following summary has the sole purpose to present certain conceptsrelating to one or more aspects and/or embodiments relating to themechanisms disclosed herein in a simplified form to precede the detaileddescription presented below.

According to an aspect, a method for adjusting the source impedance of agenerator includes generating a first signal and applying the firstsignal to a first input of a combiner and generating a second signal andapplying the second signal to a second input of the combiner. The firstand second signals are combined with the combiner at an output of thecombiner to produce power that is delivered to a plasma load, and acontrollable variable impedance is provided to an isolation port of thecombiner. The controllable variable impedance adjusted to vary thesource impedance of the generator.

According to another aspect, a power supply system includes a firstpower amplifier including an input and a first-amplifier-output and asecond power amplifier including an input and a second-amplifier-output.The power supply system also includes a four-port combiner including afirst input port disposed to receive a first signal from thefirst-amplifier-output, a second input port disposed to receive a secondsignal from the second-amplifier-output, an output port to provideoutput power, and an isolation port disposed to couple to a terminatingimpedance. The combiner is configured to combine the first signal andthe second signal to apply a power signal to the output port. Acontrollable variable impedance component is coupled to the isolationport as the terminating impedance, and a controller is configured toadjust the controllable-variable impedance component in order to modifythe source impedance of the power supply system.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a system schematic showing generator interface to plasma;

FIG. 2 is a plot of delivered power as a function of load impedanceplotted on a Smith chart with a fixed control input;

FIG. 3 is a plot of load impedance as a function of delivered power from10 to 1000 W for a specific nonlinear load;

FIG. 4 is a graph depicting a control input to delivered power transferfunction for a generator with characteristics corresponding to that ofFIG. 2 operating into a nonlinear load with the characteristics of FIG.3;

FIG. 5 is a plot of load impedance as a function of delivered power from10 to 1000 W corresponding to the plot of FIG. 3 with an additional 50Ωcable with electrical length 45° inserted between the generator and theload;

FIG. 6 is a graph depicting control input to delivered power transferfunction for a generator with characteristics corresponding to that ofFIG. 2 operating into a nonlinear load with the characteristics of FIG.5;

FIG. 7 is a graph depicting the generator and nonlinear load sensitivityvectors, S_(G) and S_(L), respectively, together with the angles ofS_(L) in relation to S_(G) that leads to predicted instability;

FIG. 8 is a control diagram depicting a closed loop control system toillustrate a more detailed analysis;

FIG. 9 shows closed loop pole locations as a function of the DC value ofthe inner product (S_(G), S_(L)) assuming single integrator closed loopcontrol with unity loop gain at 2 kHz when the DC value of (S_(G),S_(L)) is zero;

FIG. 10 shows closed loop pole locations as a function of the DC valueof the inner product (S_(G), S_(L)) assuming single integrator closedloop control with unity loop gain at 2 kHz when the DC value of (S_(G),S_(L)) is zero;

FIG. 11 is an open loop power profile of a 50Ω source impedancegenerator together with a trajectory of plasma impedance versus plasmapower for two different cable lengths between the generator andimpedance matching network at the plasma;

FIG. 12 is an open loop power profile of a non-50Ω source impedancegenerator together with a trajectory of plasma impedance vs. plasmapower for two different cable lengths between the generator andimpedance matching network at the plasma;

FIG. 13 depicts measured delivered power of a representative industrialpower amplifier as a function of load impedance plotted on a Smithchart;

FIG. 14 shows predicted delivered power of the representative industrialpower amplifier of FIG. 13 as a function of load impedance plotted on aSmith chart using a Thevenin equivalent source of 437 volt and 29−j114Ω.

FIG. 15 is a Thevenin equivalent source impedance as a function ofdelivered power into a 50Ω load for a representative power amplifier;

FIG. 16 is a schematic diagram depicting a balanced amplifier;

FIG. 17A is a schematic depicting an implementation of a four portcombiner;

FIG. 17B is a schematic depicting another implementation of a four portcombiner;

FIG. 18 shows the source impedance of the composite amplifier as afunction of the isolation port (also commonly referred to as theisolated port) termination impedance if the source impedances of theindividual power amplifiers making up the composite amplifier are zero;

FIG. 19 shows the source impedance of the composite amplifier as afunction of the isolation port termination impedance if the sourceimpedances of the individual power amplifiers making up the compositeamplifier are j20Ω;

FIG. 20 shows the source impedance of the composite amplifier as afunction of the isolation port termination impedance if the sourceimpedances of the individual power amplifiers making up the compositeamplifier are 49Ω;

FIG. 21 shows the source impedance of the composite amplifier as afunction of the isolation port termination impedance if the sourceimpedances of the individual power amplifiers making up the compositeamplifier are 30−j120Ω;

FIG. 22A is a diagram depicting a power supply system and plasma system;

FIG. 22B is a diagram depicting Thevenin equivalent models of the powersupply system and plasma system depicted in FIG. 22A;

FIG. 23A is a diagram depicting another power supply system and plasmasystem;

FIG. 23B is a diagram depicting Thevenin equivalent models of the powersupply system and plasma system depicted in FIG. 23A;

FIG. 24 is a flowchart depicting a method that may be traversed inconnection with the power supply system and the plasma system depictedin FIG. 23A;

FIG. 25 is a block diagram depicting a plasma processing system;

FIG. 26 is a block diagram depicting an exemplary embodiment of agenerator;

FIG. 27 is a block diagram depicting physical components that may beused to realize the controllers of FIGS. 25 and 26;

FIG. 28 is a flowchart depicting an exemplary method that may betraversed in connection with embodiments described herein.

DETAILED DESCRIPTION

An understanding of various embodiments of the invention is aided by ananalysis of how instability in the output power of an electricalgenerator can occur as a result of interactions between the generatorand the impedance of a nonlinear load with which it is connected.Plasma—generator interactions play a crucial role in the stability ofplasma systems. This interaction can be understood by referring toFIG. 1. In general the system can be described by three equations:

P={tilde over (f)}(C, ρ _(r), ρ_(i) , t)

ρ_(r) ={tilde over (g)}(P, t)

ρ_(i) ={tilde over (h)}(P, t)

where P is the power delivered by the generator, ρ_(r) and ρ_(i) are thereal and imaginary parts of the load reflection coefficient presented tothe generator by the plasma through the match and cables, respectively,C is the control input provided to the generator power amplifier(typically drive signal amplitude, gate bias or supply voltage), and tis time.

The initial analysis can be simplified by assuming that the changes ingenerator power in response to a change in impedance from the plasmasystem happen instantaneously and similarly the change in impedancepresented to the generator happen instantaneously when the power intothe plasma is changed. Further assuming that the system is not timedependent, we end up with

P=f(C, ρ _(r), ρ_(i))

ρ_(r) =g(P)

ρ_(i) =h(P)

Assuming the functions are differentiable and using a Taylor seriesexpansion with only the first derivatives, we can linearize the threeequations around the operating point to obtain

${dP} = {\left. {{\frac{\partial f}{\partial C}{dC}} + {\frac{\partial f}{\partial\rho_{i}}\frac{dg}{dP}{dP}} + {\frac{\partial f}{\partial\rho_{i}}\frac{dh}{dP}{dP}}}\Rightarrow{\left( {1 - {\frac{\partial f}{\partial p_{r}}\frac{dg}{dP}} - {\frac{\partial f}{\partial\rho_{i}}\frac{dh}{dP}}} \right){dp}} \right. = {\left. {\frac{\partial f}{\partial C}{dC}}\Rightarrow\frac{dP}{dC} \right. = {\frac{1}{1 - {\frac{\partial f}{\partial\rho_{r}}\frac{dg}{dP}} - {\frac{\partial f}{\partial\rho_{i}}\frac{dh}{dP}}}{\frac{\partial f}{\partial C}.}}}}$

This means that the control input to power output of the generator poweramplifier is modified by

$\frac{1}{1 - {\frac{\partial f}{\partial\rho_{r}}\frac{dg}{dP}} - {\frac{\partial f}{\partial\rho_{i}}\frac{dh}{dP}}}.$

The denominator of this multiplier is

$1 - {\frac{\partial f}{\partial\rho_{r}}\frac{dg}{dP}} - {\frac{\partial f}{\partial\rho_{i}}\frac{dh}{dP}}$

which is 1 minus the inner product of the vectors

${S_{G}\overset{\Cup}{\equiv}\left( {\frac{\partial f}{\partial\rho_{r}},\frac{\partial f}{\partial\rho_{i}}} \right)},{{{and}\mspace{14mu} S_{L}}\overset{\Cup}{\equiv}{\left( {\frac{dg}{dP},\frac{dh}{dP}} \right).}}$

The first vector, S_(G), is the sensitivity of the generator to changesin load impedance (expressed as a reflection coefficient) and the secondvector, S_(t), describes the sensitivity of the nonlinear load impedanceto changes in generator power.

Since the gain of the generator power amplifier with respect to thecontrol input approaches infinity as the inner product approaches 1, anincrease in the inner product can lead to a generator control systeminstability due to erosion of the gain and phase margins in thegenerator control loop. As long as the inner product is less than 1, adrop in control loop gain can compensate for the increase in controlinput to power output of the power amplifier. However, as soon as theinner product is larger than 1, the sign of the control input to poweroutput reverses, and no modification of the control loop gain canrestore stability. As disclosed in U.S. Pat. No. 7,570,028, a controlsystem that also uses information about the load impedance can operatein a stable fashion under these conditions. Furthermore, it isinteresting that even though the gain at DC may be inverted, with theappropriate high frequency response considered in the more detailedanalysis to follow, the system may be controllable and stable using asimple integrator in the loop.

The generator sensitivity vector S_(G) at a specific impedance and powerlevel can be found by adjusting the control input, C, so that thespecific power is produced into the specific impedance and then varyingthe load impedance with the control input fixed and recording thedelivered power as a function of load impedance. The vector S_(G) at thespecific power level into the specific load is then the gradient of thisplot of delivered power as function of load reflection coefficient atthe load reflection coefficient corresponding to the specific loadimpedance. FIG. 2 shows such a plot for finding S_(G) at 500 W into 50Ω.More specifically, FIG. 2 is a plot of delivered power as a function ofload impedance plotted on a Smith chart (so that the abscissa andordinate axes correspond to the real and imaginary parts of the loadreflection coefficient, respectively) with a fixed control input. Thegradient of this plot evaluated at the origin is the generatorsensitivity vector, S_(G), at 500 W and into 50Ω.

For a specific nonlinear load (e.g., a plasma load in a specific plasmachamber at a specific gas mixture and pressure), the load sensitivityvector, S_(L) can be found by fixing any variable match components whichmay be present and varying the delivered power and recording theimpedance presented to the generator as a function of delivered power.FIG. 3 shows such a plot for finding S_(L) at 500 W (with the matchingnetwork adjusted to present 50Ω to the generator at 500 W). Morespecifically, FIG. 3 is a plot of load impedance as a function ofdelivered power from 10 to 1000 W with o corresponding to 10 W and xcorresponding to 500 W for a specific nonlinear load. The tangent to theline at the origin corresponds to the load sensitivity vector S_(L) at500 W

By solving for the required control input to achieve the specified powerat each point on the trajectory of load impedance as a function of powerdelivered to the load, the plot of output power as a function of controlinput for the specific nonlinear load using the specific generator canbe obtained. If the inner product is bigger than one, it can be expectedthat the slope, dP/dC, would be negative. FIG. 4 shows that this isindeed the case. In particular, FIG. 4 is a graph depicting a controlinput to delivered power transfer function for a generator withcharacteristics corresponding to that of FIG. 2 operating into anonlinear load with the characteristics of FIG. 3. It should be notedthat FIG. 2 shows the response of the generator at only one fixedcontrol input. In order to construct this transfer function, theresponse at a continuum of control inputs must be known.

The load sensitivity vector S_(L) can easily be rotated by inserting anadditional length of transmission line between the generator output andthe load. The use of cables to rotate the load sensitivity vector toachieve stable operation is standard practice. For example, FIG. 5 showsthe load presented to the generator as a function of delivered powercorresponding to the load of FIG. 3 with an additional length of 50Ωcable with electrical length of 45° inserted between the generator andthe load. More specifically, FIG. 5 is a plot of load impedance as afunction of delivered power from 10 to 1000 W with o corresponding to 10W and x corresponding to 500 W corresponding to the plot of FIG. 3 withan additional 50Ω cable with electrical length 45° inserted between thegenerator and the load. The corresponding control input to deliveredpower output transfer function is shown in FIG. 6, which is a graphdepicting control input to delivered power transfer function for agenerator with characteristics corresponding to that of FIG. 2 operatinginto a nonlinear load with the characteristics of FIG. 5.

Based on the simple theory above, it would appear that the unstabledirection for the load sensitivity vector, S_(L), is when it is more orless aligned with the generator sensitivity vector, S_(G), resulting ina large positive inner product. With θ the angle between S_(G) and S_(L)one thus expects that the system would be stable as long as

$\frac{1}{1 - {{S_{G}{S_{L}}\mspace{11mu} \cos \mspace{11mu} (\theta)}}} < M$

where M is the increase in the gain of the control input to deliveredpower output that would result in an unstable control system througherosion of the gain margin. In the limiting case of infinite gainmargin,

|S _(G) ∥S _(L)|cos(74 )<1

is required to prevent an inversion of the control input to deliveredpower slope. The stable and unstable rotations of the vector S_(L) aregraphically illustrated in FIG. 7. In particular, FIG. 7 is a graphdepicting the generator and nonlinear load sensitivity vectors, S_(G)and S_(L), respectively, together with the angles of S_(L) in relationto S_(G) that leads to instability predicted by the simplified theory.

The simplified analysis with derivatives ignores the fact that there isa response over time associated with a change in inputs for both thegenerator and plasma subsystems. For example, the derivative ∂_(f)/∂_(C)is the small signal transfer function of the control input (drive level,gate bias, rail voltage etc.) to delivered power output from thegenerator, provided the load impedance remains fixed. Clearly there is afrequency response associated with this transfer function (as opposed toa flat frequency response assumed by the simplified analysis).Similarly, there is a frequency response associated with each of theother derivatives appearing in the term modifying the control todelivered power response when there is interaction between the generatorand plasma subsystems.

The total linearized transfer function from control input to deliveredpower output of the generator power amplifier in the frequency domain isthus better described by:

${H(\omega)} = {\frac{1}{1 - {{{PdR}(\omega)}.{{RdP}(\omega)}} - {{{PdX}(\omega)}.{{XdP}(\omega)}}}{{PdC}(\omega)}}$

where PdR is the linearized small signal transfer function from a changein load resistance to a change in delivered power for the generatorpower amplifier, RdP is the linearized small signal transfer functionfrom a change in delivered power to a change in resistance presented tothe generator for the plasma subsystem, PdX is the linearized smallsignal transfer function from a change in load reactance to a change indelivered power for the generator power amplifier, XdP is the linearizedsmall signal transfer function from a change in delivered power to achange in reactance presented to the generator for the plasma subsystem,and PdC is the linearized small signal transfer function from a changein control input to a change in delivered power for the generator poweramplifier where PdR, RdP, PdX, XdP, and PdC are the linearized transferfunctions assuming that all variables except resistance, reactance,delivered power, delivered power and control input, respectively, remainconstant.

To illustrate the effect of the more complete analysis, assume that thecontrol input to delivered power output of the generator in the Laplacedomain is

${H(s)} = {\frac{1}{1 - {k\frac{{a}^{2}}{\left( {s + a} \right)\left( {s + a^{*}} \right)}\frac{b}{s + b}}}{{PdC}(s)}}$

where PdC(s) is the linearized small signal transfer function from achange in control input to a change in delivered power for the generatorpower amplifier in the Laplace domain, k is the inner product

S_(G), S_(L)

at DC and

$\frac{{a}^{2}}{\left( {s + a} \right)\left( {s + a^{*}} \right)}\frac{b}{s + b}$

represents the dynamic response of the interaction between the generatorand nonlinear load. To further simplify the analysis, assume thatPdC(s)=1 and consider the closed loop poles of the setpoint to deliveredpower transfer function when the power amplifier is used in a closedloop control system with a single integrator in the loop and unity loopgain is at 2 kHz when k=0 as shown in FIG. 8.

From FIG. 8 it is clear that the closed loop transfer function is

$\frac{Y(s)}{X(s)} = {\frac{4\pi \times 10^{3}\left( {s + a} \right)\left( {s + a^{*}} \right)\left( {s + b} \right)}{{s\left\lbrack {{\left( {s + a} \right)\left( {s + a^{*}} \right)\left( {s + b} \right)} - {k{a}^{2}b}} \right\rbrack} + {4\pi \times 10^{3}\left( {s + a} \right)\left( {s + a^{*}} \right)\left( {s + b} \right)}}.}$

If k is exactly zero, the transfer function becomes

${\frac{Y(s)}{X(s)} = \frac{4\pi \times 10^{3}}{s + {4\pi \times 10^{3}}}},$

with a single pole at −4π×10³, otherwise the poles of the closed looptransfer function are the zeros of

s[(s+a)(a+a*)(a+b)−k|a| ² b]+4π×10 ³(s+a)(s+a*)(s+b)

It should be noted that as k approaches 0, the residues of the highfrequency poles approach zero and thus the high frequency poles do notdramatically affect the closed loop response if |k| is small and allpoles are in the left half of the complex plane.

Assuming that for a specific power amplifier the response of theamplifier delivered power to a modulated load impedance is approximatedby a single pole at around 20 kHz (b=2π×20>10³≈1.25×10³), and the plasmaresponse to a modulated power level is approximated by a complex polepair at −20×10³±125×10³j (a=20×10³∓125×10³j), the location of the closedloop poles as a function of k, the DC value of the inner product

S_(G), S_(L)

, is shown in FIG. 9, which depicts closed loop pole locations as afunction of the DC value of the inner product

S_(G), S_(L)

assuming single integrator closed loop control with unity loop gain at 2kHz when the DC value of

S_(G), S_(L)

is zero. Here the dynamic response of the generator-plasma interactionis assumed to have a pole at −125×10³ and a complex pole pair at−20×10³∓125×10³j.

The behavior of the closed loop poles in FIG. 9 as a function of the DCvalue of the inner product <S_(G), S_(L)> can be summarized as follows:

DC value of (S_(G), S_(L)), k Behavior k > 1.03 Unstable with naturalfrequency magnitude around 5.4 kHz −0.82 < k ≦ 1.03 Stable k ≦ −0.82Unstable with natural frequency magnitude around 27 kHz

If the pole assumed to be around 20 kHz in the above analysis is changedto a lower frequency of 800 Hz, stability is maintained over a muchlarger range of inner product values.

FIG. 10 shows the closed loop pole locations as a function of the DCvalue of the inner product

S_(G), S_(L)

assuming b=5000 and all other parameters are the same as thoseconsidered in FIG. 9.

The behavior of the closed loop poles in FIG. 10 as a function of the DCvalue of the inner product

S_(G), S_(L)

can be summarized as follows:

DC value of (S_(G), S_(L)), k Behavior k > 3.5 Unstable with naturalfrequency magnitude around 1.2 kHz −8.5 < k ≦ 3.5 Stable k ≦ −8.5Unstable with natural frequency magnitude around 20.6 kHz

Note the counter-intuitive result that the system remains stable eventhough the DC value of the inner product

S_(G), S_(L)

is bigger than one resulting in a sign change in the control input todelivered power output at DC. The system only goes unstable once theinner product exceeds 3.5.

Even though the analysis presented here is greatly simplified, theextension of the analysis to include the dynamic behavior of theinteractions correspond much better to the observed behavior of RFgenerators on plasma systems. Specifically, the stable angles of S_(L)with respect to S_(G) is observed to be around −90° and +90° withunstable behavior both when S_(L) and S_(G) are aligned and when theangle between S_(G) and S_(L) is around 180°. Furthermore, the shift infrequency between a low frequency oscillation when S_(G) and S_(L) arealigned and a high oscillation frequency when S_(G) and S_(L) areopposing is clearly observed. The existence of a high frequency pole inthe response of typical generators to a modulated load impedance hadbeen confirmed through circuit analysis and the existence of a complexpole pair in the response of plasma systems has been confirmed using astepped change in power using a linear generator and observing anunderdamped response of the plasma impedance.

Observed behavior. From the analysis presented above, it can beconcluded that meeting one of the following three conditions issufficient to ensure stability:

-   -   1. the magnitude of the generator sensitivity vector, |S_(G)|,        is small    -   2. the magnitude of the plasma sensitivity vector, |S_(L)|, is        small    -   3. S_(G) is approximately perpendicular to S_(L).

Of the three conditions noted above, only a small |S_(G)| is completelyunder control of the generator designer. In most plasma systems, animpedance matching network located close to the plasma transforms theplasma impedance to an impedance matched to the characteristic impedanceof the cable or transmission line connecting the impedance matchingnetwork to the generator, typically 50Ω. For the rest of the discussionassume that this impedance is 50Ω since it is the dominant choice.

For a generator with a source impedance equal to 50Ω, |S_(G)| is indeedzero for a 50Ω load. There are a number of techniques for designinggenerators with a 50Ω source impedance. Class A/B generators cangenerally be designed to have a 50Ω source impedance at the expense ofefficiency. Balanced amplifiers provide a way of combining highefficiency (typically class D or E) amplifiers and still have a 50Ωsource impedance at the expense of power sharing between the twoamplifiers making up the balanced amplifier when the load impedancemoves off 50Ω.

It may be assumed, and this has long been believed, that a generatorwith a 50Ω source impedance is the best type of generator to use on aplasma system since stability should be assured provided the matchingnetwork matches the plasma impedance to 50Ω. However experimentalresults show that a generator with a mismatched source impedance that isproperly aligned with the plasma impedance versus power trajectory ismore stable than a generator with a 50Ω source impedance, even if theplasma impedance is matched to 50Ω. To understand this observation,reference is made to FIG. 11, which shows the open loop power profile ofa 50Ω source impedance generator together with the impedance vs. powertrajectory of a plasma system for two different cable lengths betweengenerator and impedance matching network for the same plasma. As soon asthe plasma impedance reaches 50Ω, |S_(G)| is zero, but note thateverywhere else the inner product

S_(G), S_(L)

is not zero because the trajectory of plasma impedance crosses the openloop power profile contour lines. What this means is that once thesystem operates in a stable fashion at 50Ω it is unlikely to gounstable, but if the system is perturbed it can enter a large signalinstability. Furthermore, no change in cable length inserted between thegenerator and the matching network at the plasma can change

S_(G), S_(L)

as a function of plasma power since the power profile is circular. Itshould be noted that in practice second order effects including thealready noted dynamic nature of the interaction can result in changes inbehavior as cable length is changed.

Referring next to FIG. 12, it includes Smith charts depicting an openloop power profile of a non-50Ω (20−j20Ω) source impedance generatortogether with a trajectory of plasma impedance versus plasma power fortwo different cable lengths between the generator and impedance matchingnetwork at the plasma. It is noted that by using a non-50Ω sourceimpedance generator and an appropriate cable length between thegenerator and the matching network at the plasma, it is possible to get

S_(G), S_(L)

=0 at 50Ω. But unlike the 50Ω source impedance generator, it is alsopossible to approximately align the plasma impedance trajectory with thecontour lines of the open loop power profile of the generator. Thismakes this system less susceptible to perturbations and results in amore stable system. The drawback of a system such as this is that thesame generator, cable, and matching network is often used to drivedifferent plasmas (e.g., different gas mixtures and different pressures)and with a fixed cable length it is difficult to get the system stablefor all plasmas.

A simple solution is to simply tune the tuner to an impedance differentthan 50Ω. The problem with this approach is that many customers do notwant to see any reflected power measured by the generator as wouldresult from tuning to another impedance, and the generator may not beable to deliver the requisite power or maintain the required deliveredpower accuracy into a non-50Ω load. Another problem is that many highefficiency generators (e.g., class D or E) have source impedances thatare highly mismatched to 50Ω resulting in large |S_(G)| making it verydifficult to find the correct cable length to stabilize the system forall plasmas that the system must drive.

What is required is control over the generator source impedance and amethod for easily rotating the plasma impedance trajectory to align withthe generator open loop power profile contours. Both can be achieved ifone has arbitrary control over the generator source impedance. A way ofachieving almost arbitrary control is disclosed below.

Another option is to deliberately offset the generator source impedancea convenient amount and electronically rotate the plasma impedanceversus power trajectory as seen by the generator.

Plasma Ignition.

If the source impedance of the generator is matched to the impedancepresented to the generator by the plasma system, maximum power isdelivered in the matched state. Prior to ignition, the impedancepresented to the generator is different from the impedance presented tothe generator once the plasma is lit. With a matched source impedance,this means that the generator can deliver less power to the unlit plasmathan to the lit plasma which may inhibit plasma ignition.

Deliberately offsetting the generator source impedance can allow thegenerator to deliver more power during ignition. This offset sourceimpedance may not be the desired source impedance for stability of theplasma system so it may be desirable to switch to a different sourceimpedance once the plasma is lit. This can be done with varying thesource impedance in a continuous fashion or switching between differentpreset source impedances.

Pulse Shape Control.

If pulsed power is applied to a typical plasma load, the impedancepresented to the generator varies as a function of time. If thegenerator source impedance is 50Ω, forward power measured with respectto 50Ω (as would be measured with a 50Ω directional coupler) isindependent of load impedance and in this case forward power remainsconstant over the duration of the pulse even as the load impedancevaries over time (assuming no modulation by the generator controlsystem). This pulse shape is visually appealing and often consideredgood, but it typically means that delivered power at the start of thepulse is low and increases towards the end of the pulse where the loadimpedance is typically matched to 50Ω. Such low delivered power at thestart of a pulse can in some cases be problematic. Changing thegenerator source impedance away from 50Ω can improve power delivery atthe start of the pulse at the expense of a square forward power pulseshape and may be beneficial. Control over generator source impedancethus provides a limited but useful means of controlling pulse shape forpulsed power systems.

A Method for Controlling the Source Impedance High EfficiencyGenerators.

At some power levels it is possible to manipulate a power amplifier withmore than one control input to produce the same power with differentopen loop power profiles. This gives some control over S_(G) and canactually be highly effective. Such a method is disclosed in U.S. Pat.No. 8,258,874.

Disclosed herein are different methods of controlling the sourceimpedance of a generator that can be used at a variety of power levels.

First it should be noted that it is not obvious that the open loopperformance of high efficiency amplifiers can be described in the simpleterms of a Thevenin equivalent source. Experimental results show thatthis is indeed the case as illustrated in FIGS. 13-15. FIG. 13 forexample, depicts measured delivered power of a representative industrialpower amplifier as a function of load impedance plotted on a Smithchart, and FIG. 14 shows predicted delivered power of the representativeindustrial power amplifier of FIG. 13 as a function of load impedanceplotted on a Smith chart using a Thevenin equivalent source of 437 voltand 29−j114Ω. FIG. 15 is a Thevenin equivalent source impedance as afunction of delivered power into a 50Ω load for a representative poweramplifier;

The balanced amplifier depicted in FIG. 16 is one way of constructing an(that includes at least two constituent amplifiers) with a matched(usually 50Ω) source impedance using two identical power amplifiersdisposed between a quadrature splitter and combiner. When such abalanced amplifier operates into a 50Ω load (assuming the balancedamplifier is designed to operate into 50Ω), no power is dissipated inthe isolation resistor (which is an implementation of a terminationimpedance) of the quadrature combiner. The isolation resistor typicallycannot be removed completely from the circuit as it will usually resultin a resonant circuit dramatically increasing losses, but it can bereplaced with a different impedance as long as the mentioned resonanceis avoided. Since no power is dissipated in the resistor when thebalanced amplifier operates into 50Ω, replacing it with a differentimpedance has no effect on operation into 50Ω. FIG. 17A and FIG. 17Bshow two examples of four port combiners that can be used in theconstruction of a balanced amplifier. The combiner of FIG. 17A is anin-phase combiner. In phase combiners in conjunction with 90-degreephase shifters can be used in the construction of a balanced amplifieras depicted in FIG. 16. In FIG. 17A the port associated with the portvoltage v1 and port current i1 can be an input port, the port associatedwith v2 and i2 another input port, the port associated with v3 and i3 anoutput port and the port associated with v4 and i4 an isolation port.

The combiner of FIG. 17B is a quadrature combiner. In FIG. 17B the portassociated with v1 and i1 can be an input port, the port associated withv2 and i2 another input port, the port associated with v3 and i3 anoutput port and the port associated with v4 and i4 an isolation port.When the combiner ports of FIG. 17B is used in this way the voltage v1leads the voltage v2 by 90 degrees. Notice that because of symmetry, ifv2 should lead v1, then the roles of the isolation and output portsinterchange. Under normal conditions almost all of the total powerdelivered to the combiner at the two input ports is delivered to theoutput port and almost no power is directed to the isolation port.

If the individual amplifiers are mismatched (as is the case for highefficiency amplifiers), replacing the isolation resistor with adifferent impedance changes the effective source impedance of thecombined amplifier. In fact, if the individual amplifiers have zerosource impedances (voltage sources) or infinite source impedances(current sources) the impedance of the isolation port termination(replacing the isolation resistor in FIG. 16) becomes the sourceimpedance of the composite amplifier; if the individual amplifiers havepurely reactive source impedances, the reflection coefficientcorresponding to the dump port termination is a rotation of thereflection coefficient corresponding to the source impedance of thecomposite amplifier.

If the source impedance of the individual amplifiers are matched to thesystem impedance (typically 50Ω), no power is directed to the isolationport of the combiner and changing the isolation port terminationimpedance has no effect on the source impedance of the compositeamplifier which will be equal to the system impedance.

In some embodiments, the combiners have the property that when theplasma load is matched to the designed load impedance of the combinerand the impedance in which the isolation port is terminated is equal tothe designed termination impedance and the first and second signals fromthe respective amplifiers have the designed amplitude and phaserelationship, more than 80% of the total power supplied to the combinerby the first and second signals is delivered to the matched loadconnected to the output of the combiner and less than 20% of the totalpower supplied by the first and second signals is delivered to theisolation port termination; and when the phase of one of the inputsignals is shifted by 180 degrees with everything else left unchanged,more than 80% of the total power supplied to the combiner by the firstand second signals is delivered to the isolation port termination andless than 20% of the total power supplied to the combiner by the firstand second signals is delivered to the matched load connected to theoutput.

For practical high efficiency amplifiers where the source impedance ofthe individual amplifiers are partially mismatched to the systemimpedance, some control of the source impedance of the compositeamplifier through changing the isolation port termination impedance ispossible. It is of course always possible to make the source impedanceequal to the system impedance as is the case for a regular balancedamplifier, but in addition the source impedance can be altered withincertain bounds.

FIG. 18 shows the source impedance of the composite amplifier as afunction of the isolation port termination impedance if the sourceimpedances of the individual power amplifiers making up the compositeamplifier are zero. The real part of the source impedance is on theleft, and the imaginary part on the right. On each graph the origin isin the center, the abscissa is the real part, and the ordinate theimaginary part, respectively, of the reflection coefficient with respectto 50Ω of the isolation port termination impedance. The fact that thecontour maps perfectly fit the indicated impedances on the Smith chartmeans that in this case the isolation port termination impedance becomesthe source impedance of the composite amplifier.

FIG. 19 shows the source impedance of the composite amplifier as afunction of the isolation port termination impedance if the sourceimpedances of the individual power amplifiers making up the compositeamplifier are j20Ω (where j=√{square root over (−1)}). The real part ofthe source impedance is on the left, and the imaginary part is on theright. On each graph the origin in in the center, the abscissa is thereal part, and the ordinate the imaginary part, respectively, of thereflection coefficient with respect to 50Ω of the isolation porttermination impedance. In this case the reflection coefficientcorresponding to the source impedance of the composite amplifier is arotation of the reflection coefficient corresponding to the isolationport termination impedance. If the source impedances of the individualpower amplifiers making up the composite amplifier are j50Ω or −j50Ωthis rotation is 180° so that the source impedance of the compositeamplifier is the admittance of the isolation port termination scaled by2500;

FIG. 20 shows the source impedance of the composite amplifier as afunction of the isolation port termination impedance if the sourceimpedances of the individual power amplifiers making up the compositeamplifier are 49Ω. The real part of the source impedance is on the left,and the imaginary part is on the right. On each graph the origin is inthe center, the abscissa is the real part, and the ordinate theimaginary part, respectively, of the reflection coefficient with respectto 50Ω of the isolation port termination impedance. In this case, theisolation port termination impedance has almost no impact on the sourceimpedance of the composite amplifier. If the source impedances of theindividual power amplifiers making up the composite amplifier areexactly 50Ω the isolation port termination impedance has no impact onthe source impedance of the composite amplifier.

FIG. 21 shows the source impedance of the composite amplifier as afunction of the isolation port termination impedance if the sourceimpedances of the individual power amplifiers making up the compositeamplifier are 30−j120Ω. The real part of the source impedance is on theleft, and the imaginary part on the right. On each graph, the origin isin the center, the abscissa is the real part, and the ordinate theimaginary part, respectively, of the reflection coefficient with respectto 50Ω of the isolation port termination impedance. A source impedanceof 30−j12Ω is representative of a typical industrial amplifier. It isclear that significant control over the source impedance of thecomposite amplifier is possible.

FIGS. 18, 19, 20, and 21 illustrate a mapping that exists between theisolation port termination impedance, Zt, and the resulting generatorsource impedance, Zg. For the combiners considered in FIGS. 18, 19, 20,and 21, Zt=50Ω results in a generator source impedance of 50Ω. This isthe case for a combiner such as shown in FIG. 17B with inductorimpedances of each inductor of j50Ω, unity coupling between theinductors, and capacitor impedances of each capacitor of −j100Ω. For acombiner such as shown in FIG. 17A in conjunction with external phaseshifters (to achieve quadrature combining designed to combine two 50Ωinputs into a 50Ω load) a value of Zt=100Ω results in a generator sourceimpedance of 50Ω.

Referring to FIGS. 22A and 22B, shown are diagrams depicting animplementation where an isolation port termination impedance of Zmresults in the source impedance, Zg, of a power supply system beingmatched (e.g., conjugate matched) to a plasma system impedance. Morespecifically, FIG. 22A depicts a power supply system for providing powerto a plasma load of a plasma system. As shown, a balanced amplifier ofthe power supply system includes a first power amplifier including aninput and a first-amplifier-output and a second power amplifierincluding an input and a second-amplifier-output. A four-port(quadrature) combiner of the balanced amplifier includes a first inputport disposed to receive a first signal from the first-amplifier-outputand a second input port disposed to receive a second signal from thesecond-amplifier-output. The four-port combiner includes an output portto provide output power to the plasma system and an isolation port. Thefour-port combiner is configured to combine the first signal and thesecond signal to apply a power signal to the output port. As shown, thetermination impedance of Zm is coupled to the isolation port.

As shown in FIG. 22B (which depicts Thévinin-equivalient-models of thepower supply system and the plasma system of FIG. 22A) the terminatingimpedance, Zm, is an impedance that results in the source impedance, Zg,of the power supply system being matched (e.g., conjugate matched) to aplasma system impedance, Zp, presented to the power supply system.

Termination resistors (for use as the termination impedance) for RFapplications are generally matched to better than −20 dB return losswith respect to the designed resistor value, Rd. That is, if the actualresistor impedance is Zr, then 20log₁₀|Zr−Rd|/|Zr+Rd|<−20 or|Zr−Rd|/|Zr+Rd|<0.1. Zr is affected by the value of the resistiveelement as well as parasitic capacitance and inductance in the design ofthe resistor. As one of ordinary skill in the art will appreciate inview of this disclosure, resistors, capacitors, inductors, mutualinductors and distributed elements (e.g., transmission lines or open orshorted transmission line stubs) may be used to realize the terminationimpedance.

An offset in the termination impedance Zt from a given value results ina corresponding offset in generator source impedance. Referring to FIG.23A and 23B for example, shown is an implementation where anoffset-termination-impedance, Zot, is coupled to an isolation port ofthe balanced amplifier. More specifically, the power supply system inFIG. 23A includes a balanced amplifier that is similar to the balancedamplifier depicted in FIG. 22A except that the isolation port is coupledto the offset-termination-impedance, Zot, which is offset from theimpedance Zm (described with reference to FIGS. 22A and 22B). As shownin FIG. 23B, the result of implementing the balanced amplifier with theoffset-termination-impedance, Zot, is that the source impedance of thepower supply system, Zg, is not matched (e.g., is not conjugate matched)to the impedance presented to the power supply system.

For example, for a balanced amplifier in which each of the first andsecond power amplifiers making up the balanced amplifier has a sourceimpedance of 30−j120Ω, we have from FIG. 21 that when theoffset-termination-impedance is 16.7Ω (offset from 50Ω by 0.5 in a loadreflection coefficient magnitude sense), there is a corresponding changein generator source impedance from 50Ω (what you would have had with atermination impedance of 50Ω) to 37.25+j30.23Ω. Imperfections in anisolation resistor of the termination impedance as well as in thecombiner and output filter (not shown) can result in balanced amplifiersin which the source impedance of the power supply system, Zg, deviatesfrom a designed value, Z0, typically 50Ω. Typically, such deviations areless than −16 dB in terms of return loss or |Zg−Z0|/|Zg+Z0*|<0.15. Forall practical purposes an offset between two impedances, Z1 and Z2 ofless than 0.1 in a load reflection coefficient magnitude sense, i.e.,|Z1−Z2|/|Z1+Z2*|<0.1, where * designates taking the complex conjugate,means that the two impedances, Z1 and Z2 can be considered to benominally the same impedance. For example, 61.1Ω, 49+j9.9Ω, 40.9Ω, and49−j9.9Ω can all be considered nominally 50Ω.

In contrast, an offset in impedance of 0.3 or more between twoimpedances, Z1 and Z2, in a load reflection coefficient magnitude sense,can in a practical sense be considered different impedances since suchoffsets are highly unlikely to occur without deliberately changing animpedance value. For example, 92.9Ω, 41.7+j27.5Ω, 26.9Ω, and 41.7−j27.5Ωare highly unlikely to be just badly matched 50Ω loads. Because typicaloffsets in generator source impedance from design values due toimperfections in the isolation resistor as well as in the combiner andoutput filter can be up to 0.15 in a load reflection coefficient sense,deliberate offsets to shift the source impedance generally need to bemore than 0.15 in a load reflection coefficient magnitude sense toensure a consistent gradient in the generator sensitivity vector, S_(G).The corresponding offset in isolation port termination impedance dependson the design, but is generally larger than the offset in S_(G).

Referring again to the example given earlier in which each amplifiermaking up the balanced amplifier has a source impedance of 30−j120Ω, andZm is a termination impedance that results in the source impedance ofthe power supply system, Zg, being conjugate matched to the impedancepresented to the power supply system, Zp, the offset between theoffset-termination-impedance, Zot, and Zm is 0.5 in a load reflectioncoefficient magnitude sense while the resulting offset between theimpedance of the power supply system, Zg, and the impedance presented tothe power supply system, Zp, is 0.36 in a load reflection coefficientmagnitude sense. Because of the general requirement to offset the sourceimpedance of the power supply system, Zg, from Zp* more than 0.15 andbecause of the larger offset in Zt to affect this change, the minimumeffective offset in Zt to ensure a consistent gradient of the generatorsensitivity vector, S_(G), offsets in Zt generally need to be 0.3 ormore in a load reflection coefficient sense to be effective. In otherwords, Zot generally needs to be offset from Zm by 0.3 or more in a loadreflection coefficient magnitude sense: |Zot−Zm|/|Zot+Zm*|>0.3 where Zm*is the complex conjugate of Zm

Referring to FIG. 24, shown is a flowchart depicting a method that maybe traversed in connection with the embodiment described with referenceto FIGS. 23A and 23B. As shown, the plasma supply system is used toignite a plasma (e.g., in a sub-atmospheric-pressure plasmachamber)(Block 2402). As discussed above, the plasma supply systemincludes a balanced amplifier with a termination impedance coupled to anisolation port of the balanced amplifier. The plasma system impedancepresented to the power supply system is adjusted so that the plasmasystem impedance presented to the power supply is approximately (inother words, nominally) Zp, wherein Zp* is equal to a source impedanceof the power supply system, Zg, with a termination impedance of Zmcoupled to the isolation port (Block 2404). For example, the plasmasystem is conjugate matched to the power supply system described withreference to FIG. 22A. To adjust the plasma system impedance presentedto the power supply, the match network may be adjusted and/or the lengthof the cable may be adjusted.

One of ordinary skill in the art is very familiar with impedance matchnetworks (which may include resistive, capacitive, and inductiveelements) that may be adjusted (e.g., automatically adjusted) usinginformation (e.g., voltage, current, and phase information) about thepower applied to the plasma load to present the power supply system withan impedance that is nominally Zp. One of ordinary skill in the art isalso familiar with control logic and hardware that translates the sensedpower information (e.g., received from a directional coupler or othertype of sensor) into an adjustment signal provided to the match network.Thus, details of match networks and match network control logic are notprovided herein. But one of ordinary skill in the art readilyappreciates that the components described with reference to FIG. 27 maybe utilized in a system to adjust the match network.

Unlike prior art approaches, in the method depicted in FIG. 24 the powersupply system is provided with an offset-termination-impedance, Zot,coupled to the isolation port, which results in the source impedance,Zg, of the power supply system being offset from Zp* (Block 2406). Asdiscussed above, in many implementations Zot is offset from Zm by 0.3 ormore in a load coefficient sense: |Zot−Zm|/|Zot+Zm*|>0.3 where Zm* isthe complex conjugate of Zm And the source impedance, Zg, of the powersupply system is offset from Zp* by 0.15 or more in a load reflectioncoefficient magnitude sense: |Zg−Zp*|/|Zg+Zp|>0.15, where Zp* is thecomplex conjugate of the impedance, Zp, presented to the power supplysystem by the plasma system. Applicant has found that in many sensitiveplasma systems (which are prone to instability at any cable lengthbetween the power supply system and the plasma system), the offsetbalanced amplifier (where Zot is deliberately offset from Zm) hasdramatically better stability.

It should be recognized that the order of the activates depicted in FIG.24 need not be carried out in the order depicted in FIG. 24. Inparticular, an aspect of the method depicted in FIG. 24 is that theoffset-termination-impedance, Zot, may be provided to the power supplysystem in advance of igniting the plasma. And in many implementations,the power supply system is provided with theoffset-termination-impedance, Zot, as a fixed impedance (coupled to theisolation port) so that the source impedance, Zg, of the power supplysystem is intentionally offset from Zp* wherein Zp is an impedance thatis typically presented to power supply systems. As an example, manyoperators of plasma systems prefer to present the power supply systemwith a plasma system impedance, Zp, that is nominally 50Ω, and byproviding the power supply system with a source impedance, Zg, that isdeliberately offset from Zp*, improved stability may be achieved.

Referring next to FIG. 25, shown is a block diagram depicting anexemplary system to provide power to a plasma load 2500. As depicted,the system includes a power supply system 2501 (also referred to as agenerator 2501) that comprises a first power amplifier 2502, whichincludes an input 2504 and a first-amplifier-output 2506. Also shown isa second power amplifier 2508 that includes an input 2510 and asecond-amplifier-output 2512. The power supply system 2501 also includesa four-port combiner 2514 that includes a first input port 2516 disposedto receive a first signal from the first-amplifier-output 2506, a secondinput port 2520 disposed to receive a second signal from thesecond-amplifier-output 2512, an output port 2524 to provide outputpower, and an isolation port 2526 disposed to couple to a terminatingimpedance. In general, the combiner 2514 is configured to combine thefirst signal from the first-amplifier-output 2506 and the second signalfrom the second-amplifier-output 2512 to apply a power signal 2528 atthe output port 2524. In some embodiments, the second signal is phaseshifted between 60 and 120 degrees with respect to the first signal, andin an exemplary embodiment, the second signal is phase shifted 90degrees with respect to the first signal.

As shown, a controllable variable impedance component 2530 is coupled tothe isolation port 2526 as the terminating impedance, and a sourceimpedance controller 2532 is coupled to the controllable variableimpedance component 2530. The source impedance controller 2532 generallyoperates to adjust the controllable-variable impedance component 2530 inorder to modify the source impedance of the power supply system 2501. Asshown, the power 2528 from the combiner 2514 may be applied eitherdirectly to the plasma load or through an optional impedance matchingnetwork.

As discussed further herein, among several advantages, adjusting thesource impedance of the power supply system 2501 may enable anyinstabilities in the output power of the power supply system 2501 to bereduced. As discussed above, instabilities may occur as a result ofinteractions between the power supply system 2501 and the nonlinearimpedance of the plasma load 2500. In addition, for many applications itis desirable to apply pulsed RF power to the plasma load 2500, andadjustment of the source impedance helps to achieve a desired shape ofthe applied pulses. In particular, when the applied power is pulsed, theimpedance of the plasma load 2500 varies over the duration of the pulsein response to the application of the pulse itself, and adjustment ofthe source impedance of the power supply system 2501 enables forward andreflected power during the pulses to be modified as discussed furtherherein.

Referring next to FIG. 26, it is a block diagram depicting components ofan exemplary embodiment of a generator (e.g., an exemplary embodiment ofthe power supply system 2501). As shown, the generator includes one ormore DC power supplies 2602 that receive AC power and produce DC powerto power a radio frequency (RF) power amplifier 2604 and a controller2606. In general, the power amplifier 2604 amplifies the output of asignal generator 2642 to generate output power 2618 at a particularfrequency.

The controller 2606 in this embodiment includes a variable impedancecontroller 2632 that provides, responsive to an output signal 2614 froma sensor 2616, an impedance control signal 2610 to the controllablevariable impedance 2630. The sensor 2616 may be realized, for example,by a directional coupler or VI sensor, and the sensor 2616 may monitorone or more parameters indicative of an interaction between thegenerator and the plasma load 2500; a parameter indicative of plasmaignition; and a parameter indicative of pulse shape in a pulsed powerapplication. For example, the output signal 2614 may be indicative ofone or more of an impedance presented to the power amplifier 2604,voltage, current, and power produced by the generator. In response, thecontrollable variable impedance 2630 is adjusted based upon theimpedance control signal 2610 to achieve a source impedance thatachieves one or more objectives.

For example, the source impedance of the generator may be adjusted toreduce plasma instabilities by achieving a mismatch between the sourceimpedance of the generator from an impedance of the plasma load and thenaligning an impedance trajectory of the plasma load with contours of anopen loop profile of the power supply. In the embodiment depicted inFIG. 26, for example, a frequency tuning portion 2640 of the controller2606 may be used to adjust the frequency of an RF signal generator 2642in order to align the trajectory of the plasma load 2500 with contoursof an open loop profile of the generator. One of ordinary skill in theart will also appreciate that a match (e.g., optional match 2504) orcable length between the generator and plasma load 2500 may be adjustedto align the trajectory of the plasma load with contours of an open loopprofile of the generator.

The source impedance controller 2532, 2632 (and the controller 2606generally) may be implemented or performed in part with ageneral-purpose processor, a digital signal processor (DSP), anapplication specific integrated circuit (ASIC), a field programmablegate array (FPGA) or other programmable logic device, discrete gate ortransistor logic, discrete hardware components, or any combinationthereof designed to perform the functions described herein. Ageneral-purpose processor may be a microprocessor, but in thealternative, the processor may be any conventional processor,controller, microcontroller, or state machine. A processor may also beimplemented as a combination of computing devices, e.g., a combinationof a DSP and a microprocessor, a plurality of microprocessors, one ormore microprocessors in conjunction with a DSP core, or any other suchconfiguration.

The methods described in connection with the embodiments disclosedherein may be embodied directly in hardware, in processor executableinstructions encoded in non-transitory processor readable medium, or ina combination of the two. Referring to FIG. 27 for example, shown is ablock diagram depicting physical components that may be utilized torealize the source impedance controller 2532, 2632 (and the controller2606 generally) according to an exemplary embodiment. As shown, in thisembodiment a display portion 2712 and nonvolatile memory 2720 arecoupled to a bus 2722 that is also coupled to random access memory(“RAM”) 2724, a processing portion (which includes N processingcomponents) 2726, a field programmable gate array (FPGA) 2727, and atransceiver component 2728 that includes N transceivers. Although thecomponents depicted in FIG. 27 represent physical components, FIG. 27 isnot intended to be a detailed hardware diagram; thus many of thecomponents depicted in FIG. 27 may be realized by common constructs ordistributed among additional physical components. Moreover, it iscontemplated that other existing and yet-to-be developed physicalcomponents and architectures may be utilized to implement the functionalcomponents described with reference to FIG. 27.

This display portion 2712 generally operates to provide a user interfacefor a user, and in several implementations, the display is realized by atouchscreen display. In general, the nonvolatile memory 2720 isnon-transitory memory that functions to store (e.g., persistently store)data and processor executable code (including executable code that isassociated with effectuating the methods described herein). In someembodiments for example, the nonvolatile memory 2720 includes bootloadercode, operating system code, file system code, and non-transitoryprocessor-executable code to facilitate the execution of a methoddescribed with reference to FIG. 25 described further herein.

In many implementations, the nonvolatile memory 2720 is realized byflash memory (e.g., NAND or ONENAND memory), but it is contemplated thatother memory types may be utilized as well. Although it may be possibleto execute the code from the nonvolatile memory 2720, the executablecode in the nonvolatile memory is typically loaded into RAM 2724 andexecuted by one or more of the N processing components in the processingportion 2726.

The N processing components in connection with RAM 2724 generallyoperate to execute the instructions stored in nonvolatile memory 2720 toenable the source impedance of a generator to be modified to achieve oneor more objectives. For example, non-transitory processor-executableinstructions to effectuate the methods described with reference to FIG.25 may be persistently stored in nonvolatile memory 2720 and executed bythe N processing components in connection with RAM 2724. As one ofordinarily skill in the art will appreciate, the processing portion 2726may include a video processor, digital signal processor (DSP), graphicsprocessing unit (GPU), and other processing components.

In addition, or in the alternative, the FPGA 2727 may be configured toeffectuate one or more aspects of the methodologies described herein(e.g., the method described with reference to FIG. 25). For example,non-transitory FPGA-configuration-instructions may be persistentlystored in nonvolatile memory 2720 and accessed by the FPGA 2727 (e.g.,during boot up) to configure the FPGA 2727 to effectuate the functionsof the source impedance controllers 2532, 2632.

The input component operates to receive signals (e.g., the output signal2614 from sensor 2616) that are indicative of one or more aspects of theoutput power 2618 and/or the plasma load 2200. The signals received atthe input component may include, for example, voltage, current, forwardpower, reflected power and plasma load impedance. The output componentgenerally operates to provide one or more analog or digital signals toeffectuate an operational aspect of the generator. For example, theoutput portion may provide the impedance control signal 2610 describedwith reference to FIG. 26. When the controllable variable impedance 2630is realized by a collection of discreetly switched capacitors, forexample, the impedance control signal 2610 may be a digital signal thatis encoded with an address (e.g., a binary address) of particulardiscrete capacitors to select a particular impedance. And if thecontrollable variable impedance 2630 is realized by a continuouslyvariable capacitor, the impedance control signal 2610 may be an analogsignal that varies in magnitude based upon a particular position of thecontinuously variable capacitor.

The depicted transceiver component 2728 includes N transceiver chains,which may be used for communicating with external devices via wirelessor wireline networks. Each of the N transceiver chains may represent atransceiver associated with a particular communication scheme (e.g.,WiFi, Ethernet, Profibus, etc.).

Referring next to FIG. 25, it is a flowchart depicting a method foradjusting the source impedance of a generator that may be traversed inconnection with several of the embodiments disclosed herein. As shown, afirst signal (e.g., that is output by a first power amplifier 2202) isgenerated and applied to a first input of a combiner (e.g., the firstinput port 2216 of the combiner 2214)(Block 2502), and a second signal(e.g., that is output by a second power amplifier 2208) is generated andapplied to a second input of the combiner (e.g., the second input port2220 of the combiner 2214)(Block 2504).

The first and second signals are then combined with the combiner at anoutput of the combiner to produce power that is delivered to the plasmaload (Block 2506). As shown, a controllable variable impedance (e.g.,the controllable variable impedance 2230, 2630) is provided to anisolation port (e.g., the isolation port 2226) of the combiner (Block2508), and the controllable variable impedance is adjusted to vary thesource impedance of the generator (Block 2510).

As used herein, the recitation of “at least one of A, B and C” isintended to mean “either A, B, C or any combination of A, B and C.” Theprevious description of the disclosed embodiments is provided to enableany person skilled in the art to make or use the present invention.Various modifications to these embodiments will be readily apparent tothose skilled in the art, and the generic principles defined herein maybe applied to other embodiments without departing from the spirit orscope of the invention. Thus, the present invention is not intended tobe limited to the embodiments shown herein but is to be accorded thewidest scope consistent with the principles and novel features disclosedherein.

What is claimed is:
 1. A power supply system for providing power to a plasma load, the power supply system comprising: a first power amplifier including an input and a first-amplifier-output; a second power amplifier including an input and a second-amplifier-output; a four-port combiner including a first input port disposed to receive a first signal from the first-amplifier-output, a second input port disposed to receive a second signal from the second-amplifier-output, an output port to provide output power, and an isolation port, wherein the four-port combiner is configured to combine the first signal and the second signal to apply a power signal to the output port; an offset-termination-impedance, Zot, coupled to the isolation port, the offset-termination-impedance, Zot, is offset from an impedance, Zm, that results in the source impedance of the power supply system being matched to a plasma system impedance, Zp, presented to the power supply system by the plasma system if the impedance, Zm, is coupled to the isolation port instead of the offset-termination-impedance, Zot.
 2. The power supply system of claim 1, wherein |Zot−Zm|/|Zot+Zm*|>0.3 where Zm* is the complex conjugate of Zm
 3. The power supply system of claim 2, wherein Zp and Zm are approximately 50 Ohm so |Zp−50|/|Zp+50|<0.1 and |Zm−50|/|Zm+50|<0.1.
 4. A method for providing power to a plasma load, the method comprising: generating a first signal and applying the first signal to a first input of a combiner; generating a second signal and applying the second signal to a second input of the combiner; combining the first and second signals with the combiner at an output of the combiner to produce power that is delivered to the plasma load; providing an offset-termination-impedance, Zot, to an isolation port of the combiner, the offset-termination-impedance, Zot, is offset from an impedance, Zm, that results in the source impedance of the power supply system being matched to a plasma system impedance, Zp, presented to the power supply system by the plasma system if the impedance, Zm, is coupled to the isolation port instead of the offset-termination-impedance, Zot.
 5. The method of claim 4, wherein |Zot−Zm|/|Zot+Zm*|>0.3 where Zm* is the complex conjugate of Zm
 6. The method of claim 5, wherein Zp and Zm are approximately 50 Ohm so |Zp−50|/|Zp+50|<0.1 and |Zm−50|/|Zm+50|<0.1.
 7. A power supply system for providing power to a plasma load, the power supply system comprising: means for generating a first signal and applying the first signal to a first input of a combiner; means for generating a second signal and applying the second signal to a second input of the combiner; combiner means for combining the first and second signals to produce power that is applied to the plasma load; and an offset-termination-impedance, Zot, coupled to an isolation port of the combiner, the offset-termination-impedance, Zot, is offset from an impedance, Zm, that results in the source impedance of the power supply system being matched to a plasma system impedance, Zp, presented to the power supply system by the plasma system if the impedance, Zm, is coupled to the isolation port instead of the offset-termination-impedance, Zot.
 8. The power supply system of claim 7, wherein |Zt−Zm|/|Zt+Zm*|>0.3 where Zm* is the complex conjugate of Zm
 9. The power supply system of claim 8, wherein Zp and Zm are approximately 50 ohm so |Zp−50|/|Zp+50|<0.1 and |Zm−50|/|Zm+50|<0.1.
 10. A method for providing power to a plasma load, the method comprising: igniting a plasma with a power supply system, the power supply system including a balanced amplifier with an isolation port; adjusting a plasma system impedance so the plasma system impedance presented to the power supply system is approximately Zp, wherein Zp* is a complex conjugate of Zp, and Zp* is a source impedance of the power supply system with a termination impedance of Zm coupled to the isolation port; and providing the power supply system with an offset-termination-impedance, Zot, coupled to the isolation port so the source impedance of the power supply system is offset from Zp*.
 11. The method of claim 10, wherein providing the power supply system with an offset-termination-impedance, Zot, includes providing the power supply system with an offset-termination-impedance, Zot, that is offset from Zm by at least 0.3 in a load reflection coefficient magnitude sense.
 12. The method of claim 10, wherein providing the power supply system with an offset-termination-impedance, Zot, includes providing the power supply system with an offset-termination-impedance, Zot, so the source impedance of the power supply system is offset from Zp* by at least 0.15 in a load reflection coefficient magnitude sense.
 13. The method of claim 10, wherein the offset-termination-impedance, Zot, is provided to the power supply system as a fixed termination impedance in advance of igniting the plasma. 